User:Kim/Special Issue 27/uptime: Difference between revisions
< User:Kim | Special Issue 27
| Line 16: | Line 16: | ||
(from Sand) | (from Sand) | ||
|Semiconductor chip (CPU + GPU) | |Semiconductor chip (CPU + GPU) | ||
Broadcom BCM2835 | Broadcom BCM2835 <ref>formed into a "wafer" which builds the basis for semiconductor chip</ref> | ||
| | | | ||
| | | | ||
| Line 51: | Line 51: | ||
| | | | ||
|} | |} | ||
<references /> | |||
==publishing== | ==publishing== | ||
Revision as of 16:40, 24 May 2025
$ uptime
project description
Raspberry Pi
which model do we use?
Materials
| Material | Application
(on the raspberry pi) |
Source | Method of sourcing | Reference |
|---|---|---|---|---|
| Silicon Dioxide
(from Sand) |
Semiconductor chip (CPU + GPU)
Broadcom BCM2835 [1] |
|||
| Copper | extraction / mining | |||
| Tin | Electrical Ports | |||
| Silver | ||||
| Palladium | ||||
| Gold |
- ↑ formed into a "wafer" which builds the basis for semiconductor chip